Market Highlights
High Density Interconnect PCB Market is expected to grow from USD 8,683.9 million in 2018 to USD 15,600.6 million by 2027, at a CAGR of 12% during the forecast period, 2021–2027. A high-density interconnect, or HDI is one of the fastest-growing technology that is widely used in the PCB (printed circuit board) that possess higher wiring density per unit in comparison to conventional circuit boards. They have finer spaces and lines, capture pads, and smaller vias. HDI offers various benefits, particularly in weight, package size, performance. It is this combination that has increased its demand in mobile electronics, wearable, and handheld devices.
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Segmentation:
The MRFR report highlights an inclusive segmental analysis of the global High Density Interconnect PCB Industry based on industry vertical and the number of high-density interconnection layer.
By number of high density interconnection layer, the global high density interconnect PCB market is segmented into 1, 2, & all.
By industry vertical, the global high density interconnect PCB market is segmented into medical devices, manufacturing, automotive, telecom and IT, military and defense, consumer electronics, and others. Of these, the automotive segment will lead the market over the forecast period.
Regional Analysis
Based on the region, the global high density interconnect PCB market report covers the growth opportunities and recent trends across the Asia Pacific (APAC), North America, Europe, & the Rest of the World (RoW). Of these, North America will spearhead the market over the forecast period. The use of innovative technologies in semiconductors, the booming consumer electronics industry, the presence of leading manufacturers, and growing demand from consumer electronics and automotive industry is adding to the global high density interconnect PCB market growth in the region. The US holds the utmost share in the market.
The global high density interconnect PCB market in the APAC region is predicted to have healthy growth over the forecast period. The presence of several electronic devices manufacturing firms, accessibility of low-cost technologies, and the presence of developing economies such as India, Japan, and China are adding to the global high density interconnect PCB market growth in the region.
Key Players
Prominent players profiled in the global high density interconnect PCB market report include Austria Technologie & Systemtechnik Aktiengesellschaft (Austria), FINELINE Ltd. (Israel), FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan), Advanced Circuits (US), SIERRA CIRCUITS, INC. (US), Mistral Solutions Pvt. Ltd. (India), RAYMING (China), Millennium Circuits Limited (US), PCBCART (China), TTM Technologies (US), and Epec, LLC (US).
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High-Density Interconnect PCB Market: By Form Factor (Rack & tower servers, Blade servers), Business Type (Data centers and Enterprise customers), and Processor (X 86 servers, Non-X86 servers), Operating System (Linux and Others) – Global Forecast till 2023
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